Mobile device chips coming next year from Qualcomm will be able to use wide spectrum bands that carriers are beginning to patch together with new technology, but its lofty performance claims need to be taken with a grain of salt.
Qualcomm says its new modem and transceiver chips can take advantage of spectrum-bundling capability for theoretical speeds as high as 300Mbps. Several mobile operators are already using or preparing for those techniques, but the actual speed a subscriber could get with all that spectrum will depend on a lot of factors.
The silicon heavy-hitter announced the two chips on Wednesday. They’re due to ship in sample quantities early next year and go into the company’s RF360 Front End Solution. The new chips, called the Gobi 9×35 modem and the WTR3925 RF (radio frequency) transceiver, are designed to work with LTE networks that combine multiple bands of spectrum for higher speed.
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